The process of detecting the coplanarity of FPC connectors follows a standardized operating mode, which mainly includes three stages: pre-processing, detection execution, and data analysis. Before the homework, the sample needs to be cleaned and dusted to ensure that the surface is free of pollutants that affect the measurement accuracy. Then, the connector is fixed in a dedicated fixture and precise positioning is achieved through vacuum adsorption or mechanical clamping. During the detection phase, priority is given to using an optical projection measurement system to scan the pin array in a two-dimensional plane and generate real-time thermal maps of the height distribution of contact points; For miniaturized or high-density packaged products, switch to laser 3D scanning mode to obtain sub-micron level morphology data. During the detection process, it is necessary to synchronously record environmental parameters such as temperature and humidity, and automatically compare them with the preset tolerance range of 0.05 mm through software to issue a red label warning for over tolerance points. After completing the basic testing, the system automatically generates a quality report containing key parameters such as maximum deviation value and standard deviation, providing data support for subsequent art adjustments. This process emphasizes the linkage application of fixture calibration and compensation algorithms to ensure that the test results meet the requirements of Class 2 products in the IPC-A-610G standard.
